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Quality Control of Electronic Assemblies according to the IPC-A-610 standard

The electronic assemblies quality control service provided by the Test Engineering department is configured as a systematic multi-step process, which is essential to validate the conformity of products to the most stringent technical specifications. The mainstay of this activity is the IPC-A-610 standard, the global reference for electronic board assembly acceptability criteria(PCBA).

Through rigorous inspection based on the parameters of the standard, any welding or positioning defects can be detected early, minimizing the need for costly post-production rework. The ultimate goal remains to ensure maximum reliability of the device by ensuring that each unit meets the requirements of its class (Class 1, 2 or 3).
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The acceptability criteria and IPC Classes.

The ipc standard at 610 is divided into classes, which define the criteria for acceptability of electronic assemblies. Not all PCBAs require the same level of reliability; in fact, this varies according to the intended use of the product. Determining the class to which it belongs is the first step in establishing defect tolerance limits and inspection severities. Each electronic component is evaluated by comparing its parameters with the criteria defined by the standard, according to its class of membership.
The classes provided by the ipc at 610 are:

  • Class 1 – General electronic products: devices in which circuit operation is the only necessary element and aesthetic imperfection is unimportant. These are typically low-cost consumer electronics with a limited life cycle.
  • Class 2-Industrial and professional products: equipment for which continuity of service and long service life is required. Examples are servers, industrial instrumentation and communication systems
  • Class 3 – High reliability products for critical industries: this class represents the highest level of quality for markets such as aerospace, defense, and medical. In these areas, downtime or malfunction is not permissible because it could compromise human safety or the integrity of critical missions. Here the acceptability criteria for quality control electronic assemblies are extremely strict.
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What we check: the parameters of PCBA inspection

The inspection activity conducted by the Test Engineering department is not limited to superficial verification, but consists of a granular technical analysis of each individual element that makes up the board. Each parameter is compared with IPC-A-610 acceptability tables to ensure the repeatability and objectivity of the inspection.
Electronic assembly quality control focuses on the following critical points:

  • Solder quality (THT and SMD): verification of wetting, solder meniscus and metallized hole filling for Through-Hole Technology components, as well as proper joint formation for Surface Mount Device components.
  • Markings and traceability: checking the legibility and correctness of labels, part numbers, and screen printing markings, which are essential for product life cycle management.
  • Positioning and orientation: ascertaining correct polarity of active and passive components, verifying centering on pads, and absence of rotation or tombstoning defects.
  • Mechanical and electrical integrity: inspection for soundness of fasteners, proper crimping of terminals, and conformity of wiring and internal wiring.
  • Laminate condition and coatings: analysis of FR4 substrate to exclude delaminations, bubbles or burns, and check for uniformity of protective coatings (conformal coating) and weld masks.
  • Absence of critical defects: systematic search for anomalies such as solder bridges (short circuits), cold solder, tin balls (solder balls), or the presence of excessive voids in the joints, which could affect the long-term reliability of the PCBA.

Inspection technologies: from AOI to X-rays

To ensure maximum adherence to the IPC-A-610 standard, the test engineering department employs advanced diagnostic technologies. The integration of automated systems and functional testing allows each PCBA to be validated not only aesthetically, but also from the standpoint of structural and electrical soundness.

X-Ray Inspection (X-RAY)

For more complex packages such as BGA (Ball Grid Array) or QFN (Quad Flat No-leads), where solder joints are hidden under the component body, optical inspection is not sufficient. X-ray radiographic analysis can visualize the integrity of the tin spheres, detecting any internal voids, hidden bridges or misalignments not visible externally.

Electrical Testing (ICT and Functional Testing)

Electrical testing (E-Test) validates the operability of the board. Through In-Circuit Test (ICT), individual components and interconnections are verified, while functional tests simulate the real operating environment to measure voltages, currents, and dynamic responses to loads, ensuring that the board performs exactly as per the design specification.

First Article Inspection (FAI)

Meticulous inspection of the first part of each batch to validate the machine setup before mass production.

Thermomechanical Analysis and Standardization

Consistent application of the IPC-A-610 standard ensures quality consistency and dramatically reduces the error rate. In addition, thermomechanical analysis prevents early failures by analyzing the joints’ resistance to thermal cycling and mechanical stress, ensuring the long-term reliability of the final product.

Contact our technical team to establish a quality control plan that complies with the IPC-A-610 standard

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IPC-A-610 test with TEC Eurolab

Relying on TEC Eurolab’s Test Engineering department for quality control of electronic assemblies means being able to count on a partner with more than 35 years of experience in the testing industry. The department’s technicians are highly qualified and are able to work alongside the customer for any specific requirements, designing test campaigns built around the system or assembly to be investigated. Compliance with the most important global standards and rigorous execution of testing procedures further reinforces the reliability of testing. Objective identification of defects according to IPC acceptability classes dramatically reduces the risk of placing defective batches on the market; validation also provides valuable feedback to correct manufacturing process drifts. Finally, the customer can count on comprehensive support from test design to interpretation of test results.

FAQ - IPC-A-610 Standard

What is the IPC-A-610 standard and why is it important?

IPC-A-610, entitled “Acceptability of Electronic Assemblies,” is the most widely used international standard in the electronics industry for visual inspection of assembled boards. It is critical because it establishes objective, measurable visual criteria (target, acceptable, defect) for every aspect of PCBA, ensuring that manufacturer and end customer speak the same quality and technical language.

The difference lies in the degree of reliability required and the stringency of the inspection criteria. While Class 2 allows some cosmetic imperfections as long as they do not affect long-term operation (industrial products), Class 3 imposes minimum tolerances and much higher wetting requirements. In Class 3, hole-filling in THT components must be nearly complete and no criticality is allowed that would result in minimal risk of service interruption (critical sectors).
X-ray inspection (X-Ray) is essential when there are components on the board with terminals that are not accessible to view, such as BGA, QFN, or LGA packages. Since solder joints are located under the component body, optical inspection (AOI) cannot verify their integrity. X-rays allow detection of hidden short circuits, excessive voids, or insufficient wetting of tin balls.
Yes, through the reduction of rework and scrap. Identifying a process drift or systematic defect in the early stages, rather than after finished product or, worse, after field installation, dramatically lowers warranty service costs and optimizes the First Pass Yield of the production line.

Among the most frequent defects are:

  • Solder bridges: short circuits between adjacent pads.
  • Cold or inadequate welds: dull or incompletely wetted joints that impair conductivity.
  • Tombstoning: lifting one end of an SMD component.
  • Excess tin balls (solder balls): small residues that can migrate and cause short circuits over time.
  • Misaligned or inverted components: pick-and-place errors that do not meet IPC tolerances.

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